SIMCom Spearheads Innovation at Embedded World Nuremberg 2024

Nuremberg, Germany – April 9, 2024 – Embedded World Nuremberg 2024, a global platform and a place to meet for the entire embedded community, witnessed a convergence of leading experts, key players, and industry enthusiasts. Amidst this dynamic atmosphere, SIMCom, a global leader in IoT communication solution, emerged as a driving force of collaboration and advancement, exemplifying its commitment to connecting the embedded community.

Centered around the theme of "connecting the embedded community," SIMCom made strategic use of the global platform offered by Embedded World Nuremberg 2024. This year, SIMCom elevated the conversation by presenting pioneering insights into IoT solutions, spanning from IoT communication to comprehensive service offerings. As a result, SIMCom attracted a significant number of customers to its booth, eager to engage with its offerings.

At SIMCom's Booth Hall 3-223, visitors were treated to a comprehensive display of the  wireless modules, spanning across 5G, LTE-A, 4G, LPWA, and GNSS technologies. These advanced IoT solutions are tailored to address a diverse array of industry needs, ranging from smart energy, cities, smart health, to smart industries and so on. showcasing SIMCom's unparalleled versatility and innovation in navigating the ever-evolving IoT landscape. The booth Hall 3-223 buzzed with excitement as attendees engaged with the innovative offerings and actively participated in discussions revolving around the industry's most pressing topics.

Notably, SIMCom introduced a unique element to its booth: the presence of Red Caps. This innovative approach showcased SIMCom's pioneering work in 5G RedCap technology and sparked lively conversations, further solidifying the company's position as a leader in IoT innovation.

At Embedded World, SIMCom continued its close collaboration with Qualcomm, showcasing their joint efforts at the shared booth. SIMCom unveiled its broadest portfolio of cellular modules including LPWA, Smart Module, and 4G Modules, which garnered significant interest from attendees. Among the highlights were the SIM7070G-HP-S based on The Qualcomm® 9205S Modem, SIM7070X, SIM7080G, and SIM7090G series LPWA modules leveraging The Qualcomm® 9205 LTE modem. Additionally, SIMCom presented the SIM7022 utilizing The Qualcomm® 212 LTE IoT Modem, SIM9650L-W Edge Box, SIM9650L based on The Qualcomm® QCM6490, and SIM7672G based on The Qualcomm® 216 LTE IoT modem.

SIMCom extended a warm invitation to all attendees to join them in shaping the future of connected and intelligent IoT solutions. They urged visitors to make their way to SIMCom Booth Hall 3-223 in the following days, promising to unveil even more innovative IoT communication solutions.